CMP Equipment

Achieving a globally planar wafer surface is essential for advanced lithography and multi-layer fabrication. Chemical Mechanical Polishing (CMP) equipment is used to polish the wafer surface using a combination of chemical slurries and mechanical abrasion. 

Key suppliers of CMP equipment include Ebara and Tokyo Seimitsu from Japan, and Applied Materials from the USA. Other suppliers include Entrepix and Gigamat Technologies, both based in the USA. The CMP equipment market is primarily driven by companies from Japan and the USA, aligning with their overall strength in semiconductor manufacturing technologies.