Die Preparation Equipment

Wafer Mounting Equipment: Before the wafer is diced into individual dies, it is mounted onto a dicing tape and frame for support. Suppliers of wafer mounting equipment include Nitto, with operations in Japan and the USA , and Powatec, based in Switzerland. SPI Supplies in the USA also provides wafer mounting films. Japan and Switzerland emerge as key countries for wafer mounting equipment, indicating specialized expertise in this essential area of die preparation.   

Die Sorting and Inspection Equipment: After the wafer is diced, the individual dies need to be sorted based on their quality and performance. Automated die sorting and inspection equipment is used for this purpose. Key manufacturers include Syagrus Systems (USA, with a global presence including the Netherlands, China, and Malaysia), Royce Instruments and KLA Corporation, both from the USA, and ViTrox from Malaysia. Other suppliers are located in the USA, Japan, South Korea, and Germany. The USA and Malaysia are prominent countries for die sorting and inspection equipment, reflecting the importance of efficient and accurate die handling in the back-end of semiconductor manufacturing.