Wafer Polishing/Grinding Equipment

To achieve the extremely flat and smooth surface required for subsequent lithography steps, wafers undergo lapping and polishing processes. Chemical Mechanical Polishing (CMP) is a key technique used to achieve this mirror-like finish. Major suppliers of wafer polishing and grinding equipment include Ebara and Tokyo Seimitsu, both from Japan, and Applied Materials, based in the USA. Disco Corporation, also from Japan, is another significant player. Additionally, suppliers are located in the USA, Germany, South Korea, and China, indicating a broad geographical distribution of manufacturing capabilities. The co-leadership of Japan and the USA in this equipment category, particularly in CMP systems, emphasizes the critical nature of surface quality control in advanced semiconductor manufacturing within these regions.