Wafer Slicing/Dicing Equipment

Once the silicon ingots are grown, they are sliced into thin wafers using specialized saws. Wire saws, which use a thin wire and an abrasive slurry, and inner-diameter saws are common methods for slicing. After the wafers undergo further processing, they are diced into individual chips. Key suppliers of wafer slicing and dicing equipment include Komatsu NTC and Disco Corporation, both based in Japan. Beyond Japan, numerous suppliers are located in the USA, the United Kingdom, China, and Germany, indicating a more geographically diverse supply base for these critical processes. The use of diamond wire saws is prevalent in both slicing the initial ingot and dicing the processed wafer. Japan's strong presence in this sector highlights its advanced capabilities in precision cutting technologies, which are essential for maximizing the yield of silicon wafers. Snippet  also indicates a notable number of wafer cutting machine suppliers in China, suggesting a growing capability in this area.