IC Packaging Equipment

Die Bonding Equipment: The process of attaching the die to a lead frame or substrate is called die bonding. Major suppliers of die bonding equipment include Besi (Netherlands, Switzerland, Austria), Palomar Technologies (USA), Mycronic (Sweden, USA), and ASM Pacific Technology (Hong Kong, Singapore, Malaysia, China). Other suppliers are located in the USA, Japan, Germany, and France. The supply of die bonding equipment is globally distributed, with key players in Europe, Asia, and the USA, reflecting the international nature of IC assembly and packaging.   

Wire Bonding Equipment: Electrical connections between the die and the package leads are typically made using fine metal wires in a process called wire bonding. Key suppliers of wire bonding equipment include Kulicke & Soffa (USA, Singapore, Malaysia, China), ASM Pacific Technology (Hong Kong, Singapore, Malaysia, China), and Hesse Mechatronics (Germany, USA). Other suppliers are located in the USA, Japan, and Switzerland. The USA, Germany, and Asia are prominent in the wire bonding equipment market, aligning with the geographical distribution of IC packaging activities.   

IC Encapsulation and Molding Equipment: To protect the die and wire bonds from environmental factors, they are typically encapsulated in a molding compound. Suppliers of IC encapsulation and molding equipment include Sumitomo and Towa from Japan, and I-PEX, also from Japan, which manufactures molding machines. Japan appears to be a significant source for this type of equipment, highlighting its role in the critical packaging stage.